Merge tag 'thermal-6.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
 "These mostly continue to prepare the thermal control subsystem for
  using unified representation of trip points, which includes cleanups,
  code refactoring and similar and update several drivers (for other
  reasons), which includes new hardware support.

  Specifics:

   - Add a thermal zone 'devdata' accessor and modify several drivers to
     use it (Daniel Lezcano)

   - Prevent drivers from using the 'device' internal thermal zone
     structure field directly (Daniel Lezcano)

   - Clean up the hwmon thermal driver (Daniel Lezcano)

   - Add thermal zone id accessor and thermal zone type accessor and
     prevent drivers from using thermal zone fields directly (Daniel
     Lezcano)

   - Clean up the acerhdf and tegra thermal drivers (Daniel Lezcano)

   - Add lower bound check for sysfs input to the x86_pkg_temp_thermal
     Intel thermal driver (Zhang Rui)

   - Add more thermal zone device encapsulation: prevent setting
     structure field directly, access the sensor device instead the
     thermal zone's device for trace, relocate the traces in
     drivers/thermal (Daniel Lezcano)

   - Use the generic trip point for the i.MX and remove the
     get_trip_temp ops (Daniel Lezcano)

   - Use the devm_platform_ioremap_resource() in the Hisilicon driver
     (Yang Li)

   - Remove R-Car H3 ES1.* handling as public has only access to the ES2
     version and the upstream support for the ES1 has been shutdown
     (Wolfram Sang)

   - Add a delay after initializing the bank in order to let the time to
     the hardware to initialze itself before reading the temperature
     (Amjad Ouled-Ameur)

   - Add MT8365 support (Amjad Ouled-Ameur)

   - Preparational cleanup and DT bindings for RK3588 support (Sebastian
     Reichel)

   - Add driver support for RK3588 (Finley Xiao)

   - Use devm_reset_control_array_get_exclusive() for the Rockchip
     driver (Ye Xingchen)

   - Detect power gated thermal zones and return -EAGAIN when reading
     the temperature (Mikko Perttunen)

   - Remove thermal_bind_params structure as it is unused (Zhang Rui)

   - Drop unneeded quotes in DT bindings allowing to run yamllint (Rob
     Herring)

   - Update the power allocator documentation according to the thermal
     trace relocation (Lukas Bulwahn)

   - Fix sensor 1 interrupt status bitmask for the Mediatek LVTS sensor
     (Chen-Yu Tsai)

   - Use the dev_err_probe() helper in the Amlogic driver (Ye Xingchen)

   - Add AP domain support to LVTS thermal controllers for mt8195
     (Balsam CHIHI)

   - Remove buggy call to thermal_of_zone_unregister() (Daniel Lezcano)

   - Make thermal_of_zone_[un]register() private to the thermal OF code
     (Daniel Lezcano)

   - Create a private copy of the thermal zone device parameters
     structure when registering a thermal zone (Daniel Lezcano)

   - Fix a kernel NULL pointer dereference in thermal_hwmon (Zhang Rui)

   - Revert recent message adjustment in thermal_hwmon (Rafael Wysocki)

   - Use of_property_present() for testing DT property presence in
     thermal control code (Rob Herring)

   - Clean up thermal_list_lock locking in the thermal core (Rafael
     Wysocki)

   - Add DLVR support for RFIM control in the int340x Intel thermal
     driver (Srinivas Pandruvada)"

* tag 'thermal-6.4-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (55 commits)
  thermal: intel: int340x: Add DLVR support for RFIM control
  thermal/core: Alloc-copy-free the thermal zone parameters structure
  thermal/of: Unexport unused OF functions
  thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister
  thermal/drivers/mediatek/lvts_thermal: Add AP domain for mt8195
  dt-bindings: thermal: mediatek: Add AP domain to LVTS thermal controllers for mt8195
  thermal: amlogic: Use dev_err_probe()
  thermal/drivers/mediatek/lvts_thermal: Fix sensor 1 interrupt status bitmask
  MAINTAINERS: adjust entry in THERMAL/POWER_ALLOCATOR after header movement
  dt-bindings: thermal: Drop unneeded quotes
  thermal/core: Remove thermal_bind_params structure
  thermal/drivers/tegra-bpmp: Handle offline zones
  thermal/drivers/rockchip: use devm_reset_control_array_get_exclusive()
  dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible
  thermal/drivers/rockchip: Support RK3588 SoC in the thermal driver
  thermal/drivers/rockchip: Support dynamic sized sensor array
  thermal/drivers/rockchip: Simplify channel id logic
  thermal/drivers/rockchip: Use dev_err_probe
  thermal/drivers/rockchip: Simplify clock logic
  thermal/drivers/rockchip: Simplify getting match data
  ...

2 files changed, 44 insertions, 42 deletions

diff --git a/Documentation/driver-api/thermal/intel_dptf.rst b/Documentation/driver-api/thermal/intel_dptf.rst
index f5c193cccbda01..9ab4316322a1ac 100644
--- a/Documentation/driver-api/thermal/intel_dptf.rst
+++ b/Documentation/driver-api/thermal/intel_dptf.rst
@@ -184,8 +184,9 @@ ABI.
 DPTF Processor thermal RFIM interface
 --------------------------------------------
 
-RFIM interface allows adjustment of FIVR (Fully Integrated Voltage Regulator)
-and DDR (Double Data Rate)frequencies to avoid RF interference with WiFi and 5G.
+RFIM interface allows adjustment of FIVR (Fully Integrated Voltage Regulator),
+DDR (Double Data Rate) and DLVR (Digital Linear Voltage Regulator)
+frequencies to avoid RF interference with WiFi and 5G.
 
 Switching voltage regulators (VR) generate radiated EMI or RFI at the
 fundamental frequency and its harmonics. Some harmonics may interfere
@@ -196,6 +197,15 @@ small % and shift away the switching noise harmonic interference from
 radio channels.  OEM or ODMs can use the driver to control SOC IVR
 operation within the range where it does not impact IVR performance.
 
+Some products use DLVR instead of FIVR as switching voltage regulator.
+In this case attributes of DLVR must be adjusted instead of FIVR.
+
+While shifting the frequencies additional clock noise can be introduced,
+which is compensated by adjusting Spread spectrum percent. This helps
+to reduce the clock noise to meet regulatory compliance. This spreading
+% increases bandwidth of signal transmission and hence reduces the
+effects of interference, noise and signal fading.
+
 DRAM devices of DDR IO interface and their power plane can generate EMI
 at the data rates. Similar to IVR control mechanism, Intel offers a
 mechanism by which DDR data rates can be changed if several conditions
@@ -264,6 +274,38 @@ DVFS attributes
 ``rfi_disable (RW)``
 	Disable DDR rate change feature
 
+DLVR attributes
+
+:file:`/sys/bus/pci/devices/0000\:00\:04.0/dlvr/`
+
+``dlvr_hardware_rev`` (RO)
+	DLVR hardware revision.
+
+``dlvr_freq_mhz`` (RO)
+	Current DLVR PLL frequency in MHz.
+
+``dlvr_freq_select`` (RW)
+	Sets DLVR PLL clock frequency. Once set, and enabled via
+	dlvr_rfim_enable, the dlvr_freq_mhz will show the current
+	DLVR PLL frequency.
+
+``dlvr_pll_busy`` (RO)
+	PLL can't accept frequency change when set.
+
+``dlvr_rfim_enable`` (RW)
+	0: Disable RF frequency hopping, 1: Enable RF frequency hopping.
+
+``dlvr_spread_spectrum_pct`` (RW)
+	Sets DLVR spread spectrum percent value.
+
+``dlvr_control_mode`` (RW)
+        Specifies how frequencies are spread using spread spectrum.
+        0: Down spread,
+        1: Spread in the Center.
+
+``dlvr_control_lock`` (RW)
+    1: future writes are ignored.
+
 DPTF Power supply and Battery Interface
 ----------------------------------------
 
diff --git a/Documentation/driver-api/thermal/sysfs-api.rst b/Documentation/driver-api/thermal/sysfs-api.rst
index 2e0f79a9e2ee13..6c1175c6afba99 100644
--- a/Documentation/driver-api/thermal/sysfs-api.rst
+++ b/Documentation/driver-api/thermal/sysfs-api.rst
@@ -306,42 +306,6 @@ temperature) and throttle appropriate devices.
 
     ::
 
-	struct thermal_bind_params
-
-    This structure defines the following parameters that are used to bind
-    a zone with a cooling device for a particular trip point.
-
-    .cdev:
-	     The cooling device pointer
-    .weight:
-	     The 'influence' of a particular cooling device on this
-	     zone. This is relative to the rest of the cooling
-	     devices. For example, if all cooling devices have a
-	     weight of 1, then they all contribute the same. You can
-	     use percentages if you want, but it's not mandatory. A
-	     weight of 0 means that this cooling device doesn't
-	     contribute to the cooling of this zone unless all cooling
-	     devices have a weight of 0. If all weights are 0, then
-	     they all contribute the same.
-    .trip_mask:
-	       This is a bit mask that gives the binding relation between
-	       this thermal zone and cdev, for a particular trip point.
-	       If nth bit is set, then the cdev and thermal zone are bound
-	       for trip point n.
-    .binding_limits:
-		     This is an array of cooling state limits. Must have
-		     exactly 2 * thermal_zone.number_of_trip_points. It is an
-		     array consisting of tuples <lower-state upper-state> of
-		     state limits. Each trip will be associated with one state
-		     limit tuple when binding. A NULL pointer means
-		     <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
-		     These limits are used when binding a cdev to a trip point.
-    .match:
-	    This call back returns success(0) if the 'tz and cdev' need to
-	    be bound, as per platform data.
-
-    ::
-
 	struct thermal_zone_params
 
     This structure defines the platform level parameters for a thermal zone.
@@ -357,10 +321,6 @@ temperature) and throttle appropriate devices.
 	       will be created. when no_hwmon == true, nothing will be done.
 	       In case the thermal_zone_params is NULL, the hwmon interface
 	       will be created (for backward compatibility).
-    .num_tbps:
-	       Number of thermal_bind_params entries for this zone
-    .tbp:
-	       thermal_bind_params entries
 
 2. sysfs attributes structure
 =============================